MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
期刊基本信息
期刊名称:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
出版国家或地区:ENGLAND
是否OA:No
期刊ISSN:1369-8001
期刊官方网站:http://www.elsevier.com/wps/find/journaldescription.cws_home/600849/description#description
期刊投稿网址:http://ees.elsevier.com/mssp/
通讯方式:ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
涉及的研究方向:工程技术-材料科学:综合
出版周期:Bimonthly
期刊数据表:
最新中科院JCR分区
|
大类(学科)
小类(学科)
JCR学科排名
物理
ENGINEERING, ELECTRICAL & ELECTRONIC(工程学,电气和电子) 3区
MATERIALS SCIENCE, MULTIDISCIPLINARY(材料科学,跨学科) 3区
PHYSICS, APPLIED(物理学,应用) 3区
PHYSICS, CONDENSED MATTER(物理学,凝聚态) 3区
92/260
102/285
49/146
28/67
|
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最新的影响因子
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3.085 | |||||||
最新公布的期刊年发文量 |
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总被引频次 | 7465 | |||||||
特征因子 | 0.012310 |
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING英文简介:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING中文简介:
半导体加工中的材料科学为讨论光电子、传感器、探测器、生物技术和绿色能源的功能材料和器件的新加工、应用和理论研究提供了一个独特的论坛。每一期将致力于提供当前的快照的见解、新成果,突破和未来趋势等不同领域的微电子、能源转换和存储、通信、生物技术(图)催化、纳米薄膜技术,混合和复合材料、化学处理、气相沉积、设备制造、和造型的支柱先进半导体加工和应用。覆盖范围将包括:用于亚微米设备的先进光刻技术;蚀刻及相关课题;离子注入;损害演化及其相关问题;等离子体和热CVD;快速热处理;先进的金属化和互连方案;介质层薄,氧化;溶胶-凝胶法加工;化学浴和(电)化学沉积;化合物半导体加工;新型非氧化物材料及其应用(宏观)分子和杂化材料;分子动力学、从头算方法、蒙特卡罗方法等;分立电路和集成电路的新材料和新工艺;磁性材料和自旋电子学;异质结构和量子器件;半导体光电特性工程;晶体生长机制;可靠性,缺陷密度,固有杂质和缺陷。
历年影响因子
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING在线问答:
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