IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

期刊基本信息

期刊名称：IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

出版国家或地区：UNITED STATES

是否OA：No

期刊ISSN：0894-6507

期刊官方网站：http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=66

期刊投稿网址：http://mc.manuscriptcentral.com/tsm-ieee

通讯方式：IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

涉及的研究方向：工程技术-工程：电子与电气

出版周期：Quarterly

期刊数据表：

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING英文简介：

The IEEE Transactions on Semiconductor Manufacturing publishes the latest advances related to the manufacture of microelectronic and photonic components and integrated systems, including photovoltaic devices and micro-electro-mechanical systems. Its principal aim is to continually enhance the knowledge base and improve manufacturing practice across the entire supply chain from fabrication to delivery of these devices. Areas of interest include process integration, manufacturing equipment performance and modeling, yield analysis and enhancement, metrology, process control, material handling, factory systems and all areas of factory and supply chain management related to the semiconductor industry including materials synthesis, equipment manufacturing, and mask making. Papers submitted to this journal should have a clear relevance to manufacturing practice, as opposed to device design and device characterization.

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING中文简介：

IEEE《半导体制造学报》发表了与微电子和光子元件及集成系统(包括光伏器件和微电子机械系统)制造有关的最新进展。其主要目标是不断增强知识基础和改善整个供应链的制造实践，从制造到交付这些设备。感兴趣的领域包括过程集成、制造设备性能和建模、产量分析和增强、计量学、过程控制、材料处理、工厂系统以及与半导体行业相关的所有工厂和供应链管理领域，包括材料合成、设备制造和掩模制造。提交给本杂志的论文应该与制造实践有明确的相关性，而不是设备设计和设备特性。

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