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MICROPROCESSORS AND MICROSYSTEMS

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期刊基本信息

期刊名称:MICROPROCESSORS AND MICROSYSTEMS

出版国家或地区:NETHERLANDS

是否OA:No

期刊ISSN:0141-9331

期刊官方网站:http://www.journals.elsevier.com/microprocessors-and-microsystems/

期刊投稿网址:http://ees.elsevier.com/micpro/tempdown.asp

通讯方式:ELSEVIER SCIENCE BV, PO BOX 211, AMSTERDAM, NETHERLANDS, 1000 AE

涉及的研究方向:工程技术-工程:电子与电气

出版周期:Bimonthly

出版年份:1978

期刊数据表:

最新中科院JCR分区
大类(学科)
小类(学科)
JCR学科排名
工程技术
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE(计算机科学,硬件和体系架构) 4区 COMPUTER SCIENCE, THEORY & METHODS(计算机科学,理论和方法) 4区 ENGINEERING, ELECTRICAL & ELECTRONIC(工程学,电气和电子) 4区
36/52 60/103 199/260
最新的影响因子
1.161
最新公布的期刊年发文量
年度总发文量 年度论文发表量 年度综述发表量
158 158 0
总被引频次 1017
特征因子 0.001880

MICROPROCESSORS AND MICROSYSTEMS英文简介:

Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC).Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systems are also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.

MICROPROCESSORS AND MICROSYSTEMS中文简介:

微处理器和微系统:嵌入式硬件设计(MICPro)是一本涵盖与嵌入式系统硬件相关的所有设计和体系结构方面的杂志。这包括不同的嵌入式系统硬件平台,从定制硬件到可重新配置的系统和特定于应用程序的处理器,再到通用嵌入式处理器。重点介绍了新型复杂的嵌入式体系结构,如片上系统(SOC)、可编程/可重构芯片系统(SOPC)和片上多处理器系统(MPSOC),以及它们的存储和通信方法和结构,如片上网络(NOC)。这些系统的设计自动化,包括设计方法、技术、流程和工具,以及硬件组件的新设计,都属于本杂志的范围。使用嵌入式系统的新型网络物理应用也是本杂志的中心。虽然本杂志的主要关注点不是软件,但是考虑到软件和硬件组件之间的相互作用(重点是硬件)的硬件/软件协同设计方法以及应用程序重组和到嵌入式硬件平台的映射也在本杂志的范围内。

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