PLASMA CHEMISTRY AND PLASMA PROCESSING

期刊基本信息

期刊名称：PLASMA CHEMISTRY AND PLASMA PROCESSING

出版国家或地区：UNITED STATES

是否OA：No

期刊ISSN：0272-4324

期刊官方网站：http://www.springer.com/physics/classical+continuum+physics/journal/11090

期刊投稿网址：http://mc.manuscriptcentral.com/pcpp

通讯方式：SPRINGER, 233 SPRING ST, NEW YORK, USA, NY, 10013

涉及的研究方向：工程技术-工程：化工

出版周期：Quarterly

出版年份：1981

期刊数据表：

PLASMA CHEMISTRY AND PLASMA PROCESSING英文简介：

Plasma Chemistry and Plasma Processing is an international journal that provides a forum for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The journal encompasses all types of industrial processing plasmas, ranging from nonthermal plasmas to thermal plasmas, and publishes fundamental plasma studies as well as studies of specific plasma applications. Application contexts of interest include plasma etching in microelectronics and other fields, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and others. Includes studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces.

PLASMA CHEMISTRY AND PLASMA PROCESSING中文简介：

《等离子体化学与等离子体处理》是一份国际期刊，为发表有关等离子体化学与等离子体处理的基础研究和新进展的原始论文提供了一个论坛。该杂志涵盖了所有类型的工业加工等离子体，从非热等离子体到热等离子体，并出版了基础等离子体研究以及特定等离子体应用的研究。感兴趣的应用领域包括微电子和其他领域的等离子体蚀刻、薄膜和涂层的沉积、粉末合成、环境处理、照明、表面改性等。包括等离子体的化学动力学研究，以及等离子体与表面的相互作用。

历年影响因子

PLASMA CHEMISTRY AND PLASMA PROCESSING在线问答：